1/3 rev. c structure silicon monolit hic integrated circuit product series 2-phase half-wave motor driver for fan motor type ? features built - in reverse current protection diode absolute maximum ratings parameter symbol limit unit supply voltage vcc 36 v power dissipation pd 780 mw operating temperature range topr -40 +100 storage temperature range ts t g - 5 5 +150 output current iomax 800 ma al signal output current ial 10 ma al signal output voltage val 36 v fg signal output current ifg 10 ma fg signal output voltage vfg 36 v junction temperature tjmax 150 to use at temperature above ta=25 reduce 6.24mw/ . (on 70.0mm 70.0mm 1.6mm glass epoxy board) this value is not to be over pd. operating conditions parameter symbol limit unit operating supply voltage range vcc 6.0 28.0 v hall input voltage range vh 0 vcc-3.0 v this product is not designed for production against radioactive rays.
2/3 rev. c electrical characteristics (unl ess otherwise specified ta=25 ,vcc=12v) parameter symbol limit unit conditions min. typ. max. circuit current icc 3 6 9 ma hall input offset voltage vhofs -10 - 10 mv hall input hysteresis vhys 5 10 15 mv output l voltage vol - 0.30 0.50 v io=200ma output leak current iol - - 100 a vo=45v output zenner voltage voz 50 54 58 v clamp current=10ma lock detection on time ton 0.30 0.50 0.70 sec lock detection off time toff 3.0 5.0 7.0 sec al terminal voltage l vall - - 0.4 v ial=5ma al terminal leak current iall - - 50 a val=36v fg terminal voltage l vfgl - - 0.4 v ifg=5ma fg terminal leak current ifgl - - 50 a vfg=36v package outlines block diagram te r m i n a l n a m e pin no. terminal name 1 out2 2 al 3 fg 4 vcc 5 h+ 6 h- 7 out1 8 gnd 0.3min. 0.150.1 0.40.1 0.11 6.20.3 4.40.2 5.00.2 85 41 1.27 1.50.1 0.1 6701 lot no. sop 8(unit:mm) control tsd reg hall amp 1 2 3 4 8 7 6 5 - + pre drive lock detect auto restart osc out2 a l fg vcc h+ h- out1 gnd
3/3 rev. c cautions on use 1) absolute maximum ratings an excess in the absolute maximum rations, such as supply volt age, temperature range of operating conditions, etc., can break d own the devices, thus making impossibl e to identify breaking mode, such as a short circuit or an open circuit. if any over rated va lues will expect to exceed the absolute maximu m ratings, consider adding circuit protection devices, such as fuses. 2) connecting the power supply connector backward connecting of the power supply in reverse polarity can damage ic. take precautions w hen connecting the power supply lines. an external direction diode can be added. 3) power supply line back electromotive force causes regenerated cu rrent to power supply line, therefore take a measure such as placing a capacitor between power supply and gnd for routing regenerated current. and fu lly ensure that the capacitor characteristics have no probl em before determine a capacitor value. (when applying electrolytic ca pacitors, capacitance characteri stic values are reduced at lo w temperatures) 4) gnd potential the potential of gnd pin must be minimum potential in all operating conditions. also ens ure that all terminals except gnd termi nal do not fall below gnd voltage including transient characteristics. however, it is possi ble that the motor output terminal may d eflect below gnd because of influence by back el ectromotive force of motor. malfunction may possibly occur depending on use condition, environment, and property of individual motor. please make fully confirmation that no problem is found on operation of ic. 5) thermal design use a thermal design that allows for a sufficient margin in li ght of the power dissipation(pd) in actual operating conditions. 6) inter-pin shorts and mounting errors use caution when positioning the ic for m ounting on printed circuit boards. the ic ma y be damaged if there is any connection er ror or if pins are shorted together. 7) actions in strong electromagnetic field use caution when using the ic in the presence of a strong electromagnetic field as doi ng so may cause the ic to malfunction. 8) aso when using the ic, set the output transistor so that it does not exceed absolute maximum rations or aso. 9) thermal shut down circuit the ic incorporates a built-in thermal shutdown ci rcuit (tsd circuit). operation temperature is 175 (typ.) and has a hysteresis width of 25 (typ.). when ic chip temperature rises and tsd circuit works, the output terminal becomes an open state. tsd circuit is designed only to shut the ic off to prevent thermal runaway. it is not designed to protect the ic or guarantee its operation. d o not continue to use the ic after operation this circuit or use the ic in an environment wh ere the operation of this circuit is assu med. 10) testing on application boards when testing the ic on an application board, connecting a capacitor to a pin with low impedance subjects the ic to stress. alwa ys discharge capacitors after each process or step. always turn the ic?s power supply off before connecting it to or removing it f rom a jig or fixture during the inspection process. ground the ic during asse mbly steps as an antistatic measure. use similar precaution when transporting or storing the ic. 11) gnd wiring pattern when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a si ngle ground point at the ground potential of application so that th e pattern wiring resistance and voltage variations caused by larg e currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any ext ernal components, either. 12) capacitor between output and gnd when a large capacitor is connected between output and gnd, if vcc is shorted with 0v or gnd for some cause, it is possible tha t the current char ged in the capacitor may flow into the output resulting in destruction. keep the capacitor between output and g nd below 100uf. 13) ic terminal input when vcc voltage is not applied to ic, do not apply voltage to eac h input terminal. when voltage above vcc or below gnd is appl ied to the input terminal, parasitic element is actuated due to the st ructure of ic. operation of pa rasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. do not use in a manner where parasi tic element is actuated.
r1120 a www.rohm.com ? 2011 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redundancy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.
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